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Plasmatherm Etcher SLR-720 Chlorine

  1. Parallel plate RIE with temperature controlled 11 inch electrode.
  2. Turbomolecular pumped chamber with load lock.
  3. Chlorine etch chemistries for silicon, and polysilicon.  Additional passivation chemistries for controlled isotropic aluminum features.
  4. Handles samples from pieces up to 8 inch substrates.
  5. The following gases are available:

Tool Manager: Brian Bowman

This material is based upon work supported in part by the STC Program of the National Science Foundation under Agreement No. ECS-9876771. Any opinions, findings, and conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.
Any opininons, findings, conclusions or recommendations expressed are those of the author(s) and do not necessarily reflect the views of the New York State Office of Science, Technology and Academic Research.


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